JPH0113422Y2 - - Google Patents
Info
- Publication number
- JPH0113422Y2 JPH0113422Y2 JP648984U JP648984U JPH0113422Y2 JP H0113422 Y2 JPH0113422 Y2 JP H0113422Y2 JP 648984 U JP648984 U JP 648984U JP 648984 U JP648984 U JP 648984U JP H0113422 Y2 JPH0113422 Y2 JP H0113422Y2
- Authority
- JP
- Japan
- Prior art keywords
- press
- disc spring
- case
- pressure
- cylindrical case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000003466 welding Methods 0.000 description 21
- 238000003825 pressing Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 210000005069 ears Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP648984U JPS60118241U (ja) | 1984-01-20 | 1984-01-20 | 半導体素子の圧接構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP648984U JPS60118241U (ja) | 1984-01-20 | 1984-01-20 | 半導体素子の圧接構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60118241U JPS60118241U (ja) | 1985-08-09 |
| JPH0113422Y2 true JPH0113422Y2 (en]) | 1989-04-19 |
Family
ID=30483974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP648984U Granted JPS60118241U (ja) | 1984-01-20 | 1984-01-20 | 半導体素子の圧接構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60118241U (en]) |
-
1984
- 1984-01-20 JP JP648984U patent/JPS60118241U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60118241U (ja) | 1985-08-09 |
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